Light-emitting diode illuminated light-emitting

ABSTRACT

The present invention relates to a light-emitting diode illuminated light-emitting module. The disadvantages of low light-emitting efficiency and high requirement of the install technology are involved in the conventional LED module. The light-emitting module of the present invention comprises an optical processing board, a transparent substrate located below the optical processing board, and a reflection board located below the transparent board, wherein the electrode pads and the associated connections connecting between the electrode pads are placed on the transparent substrate; the light-emitting diode chips, which are placed to emit the light toward the reflection board, are installed on the electrode pads; and the reflection mirrors are placed on the surface of the reflection board near the light-emitting diode chips.

FIELD OF THE INVENTION

[0001] The present invention relates to a light-emitting diode (LED)incorporated light-emitting module suitable for illuminating. Moreparticularly, it relates to a light-emitting diode illuminatedlight-emitting module based on primary one reflection principle.

BACKGROUND OF THE INVENTION

[0002] There are two methods to produce conventionally the LEDilluminated module. One method is to solder the LED chip on a circuitboard and the light emitted by the LED will be directed out from thefront side. The main disadvantage of such type of the modules is thatthe light-emitting efficiency is too low. The another method is to packseveral single LEDs together according to a specific form. The method ofdirecting the light out from the front side is still used in the LEDmodules produced by such method, thus, the light-emitting efficiency isstill low. Moreover the operation principle of the modules installedwith an optical processing system is rather complicated, in which theLED modules should be installed manually one by one, therefore, thetechnique of the modern semiconductor technology can not be used.

SUMMARY OF THE INVENTION

[0003] Thus, the object of the present invention is to provide alight-emitting diode illuminated light-emitting module based on primaryreflection principle with the features of high light-emitting efficiencyand easy to install accurately.

[0004] According to the above object of the present invention, alight-emitting diode illuminated light-emitting module will be providedby the present invention, it comprises an optical processing board, atransparent substrate located below, said optical processing board, anda reflection board located below said transparent substrate wherein theelectrode pads and the associated connections connecting between saidelectrode pads are placed on said transparent substrate; the LED chips,which are placed to emit light toward said reflection board, areinstalled on said electrode pads; the reflection mirrors are installednear said LED chips on the surface of said reflection board.

[0005] Because primary reflection principle is used in the LEDilluminated light-emitting module of the present invention, therefore,the light-emitting efficiency is high. The structure is compact withexcellent sealing. It is easy to be integrated and characterized by thecompact single chip. Especially, the LED chips can be soldered directlyon the transparent substrate by using the semiconductor surface mountingtechnique (SMD), and the heat dissipation will be more excellent and theluminosity can be increased by a large amount. Several LED chips withdifferent colors can be surface mounted together simultaneously so thatthe excellent mixed color effect can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The preferred embodiments of the present invention will bedescribed in detail below in conjunction with the accompanying drawings,wherein:

[0007]FIG. 1 is a schematic view showing the structure of the LEDilluminated light-emitting module in accordance with an embodiment ofthe present invention;

[0008]FIG. 2 is an optical reflection principle diagram of thereflection board with a parabolic shown in FIG. 1;

[0009]FIG. 3 is a schematic view showing the structure of the LEDilluminated light-emitting module in accordance with another embodimentof the present invention;

[0010]FIG. 4 is an optical reflection principle diagram of thereflection board with a plane surface shown in FIG. 3.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Referring to FIG. 1, an embodiment of the present invention isshown in FIG. 1. It can be seen from FIG. 1 that the LED illuminatedlight-emitting module of the present invention comprises: an opticalprocessing board 1, a transparent substrate 2, a reflection board 7, anda light reflection cavity board 9. The optical processing board 1 islocated at the utmost top (external) layer (seen from the direction asshown in FIG. 1, the same below). The transparent substrate 2 is locatedbelow the optical processing board 1, and the reflection board 7 islocated under the transparent substrate 2 and within the lightreflection cavity 10 constructed by the light reflection cavity board 9.On the surface of the transparent substrate 2 near the reflection board7, the electrode pads and the associated connections 3 used to connectthe electrode pads are deposed. The LED chips 4, which are placed toemit light toward the reflection board 7, are soldered on the electrodepads. The transparent and conductive materials can be used to producethese electrode pads and the associated connections 3.

[0012] As shown in FIG. 1, the reflection board 7 has a structure of aparabolic shape. Each of the LED chips 4 is placed above each of theparabolic surfaces, and the LED chip 4 is located right at the focus ofthe parabolic. In order to increase the reflection capability of thereflection board 7, the reflection mirrors can be placed near the LEDchips 4 on the surface of the reflection board 7.

[0013] Refer to FIG. 2 please, an optical reflection principle diagramof the reflection board 7 with a parabolic is shown in FIG. 2. In FIG.2, after the dispersing light emitted by the LED chips 4 is reflected bythe parabolic, it becomes the parallel light and incidents to thetransparent substrate 2 and the optical processing board 1 in turn. Boththe transparent substrate 2 and the optical processing board 1 are thelight penetrating boards, they can be produced to form a variety ofshapes according to the practical requirements. Normally, thetransparent substrate 2 can be produced with a plan board shape, ofcourse, it can also be produced with a specific curved surface. Thereflection and refraction of the outgoing light can be controlled by theoptical processing board 1, thus, the optical processing board 1 can beproduced as a convergence lens or a divergence lens to further convergeor diverge the outgoing light.

[0014] In another embodiment, the optical processing board 1 and thetransparent substrate 2 can also be produced integrally.

[0015] As shown in FIG. 1, since the reflection board 7 on which thereflection mirrors (the metal reflection films are normally used) areplaced is located near the transparent substrate 2 on which theelectrode pads and the associated connections 3 are placed, therefore,the short circuit of the electrode pads and the associated connections 3of the transparent substrate 2 may be caused easily by the reflectionmirrors of the reflection board 7. In order to prevent such situationfrom occurring, the insulation materials (not shown) can be coated overthe surface of the electrode pads and the associated connections of thetransparent substrate 2. Another method of preventing the short circuitfrom occurring is to reserve on the reflection mirrors of the reflectionboard 7 the spaces corresponding to the electrode pads and theassociated connections 3 of the transparent substrate 2.

[0016] Label 6 in FIG. 1 is a hole, which is placed within the lightreflection cavity board 9, used for directing the electrodes out. It isused for directing the electrode pads and the associated connections outfrom this hole 6 to connect with the external control circuits and tocontrol the light emitted from the relative LED chips 4.

[0017] Furthermore, for the convenience of installing and integratingthe LED illuminated light-emitting module, a fix hole or fix pin 8 canbe placed on the bottom of the light reflection cavity board 9. Thelight-emitting module can be fixed on the auxiliary device through thisfix hole or fix pin 8. Furthermore, the fix hole or fix pin may beplaced on both sides of the light reflection cavity board 9 (not shown).It is capable to connect and combine with the neighboring LEDilluminated light-emitting module through the fix hole or fix pin onboth sides. Of cause, the fix holes can be placed on both the bottom andthe side of the light reflection cavity board 9 for the convenience ofinstalling and combining flexibly.

[0018] In the embodiment shown in FIG. 1, two LED chips 4 and twocorresponding parabolic surfaces are shown. It should be understood thatsingle LED chip 4 may be placed only to configure the monomericstructure according to the practical requirement. Also, a plurality ofthe LED chips 4 may be arranged in a line to configure an in-linestructure. Or, a plurality of the LED chips 4 may be arranged in aplurality of lines to configure an array structure.

[0019] Referring to FIG. 3, another embodiment of the present inventionis shown in FIG. 3. The structure of said embodiment is basically assame as the embodiment shown in FIG. 1, the only difference between themis that the plane board structure is used for the reflection board 7A ofsaid embodiment. The reflection mirrors are also placed on saidreflection board 7A. The optical reflection principle of the planereflection board is shown in FIG. 4. As shown in FIG. 4, the feature ofthe structure, in which the plane reflection board is used, is that itis capable to make the light emitted from the LED chips evenly, so thedim region caused by the distance separated between the LED chips willbe decreased, thereby the well-distributed light-emitting effect can beobtained.

What is claimed is:
 1. A light-emitting diode illuminated light-emitting module, comprising an optical processing board; a transparent substrate located below said optical processing board; and a reflection board located below said transparent substrate, wherein the electrode pads and the associated connections connecting between the electrode pads are placed on said transparent substrate; the light-emitting diode chips, which are placed to emit light toward said reflection board, are installed on said electrode pads; and the reflection mirrors are placed on the surface of said reflection board near said LED chips.
 2. The light-emitting diode illuminated light-emitting module according to claim 1, wherein, said reflection board has a parabolic structure.
 3. The light-emitting diode illuminated light-emitting module according to claim 1, wherein, said reflection board has a plane board structure.
 4. The light-emitting diode illuminated light-emitting module according to claim 1, 2, or 3, wherein, said optical processing board is a convergence lens.
 5. The light-emitting diode illuminated light-emitting module according to claim 1, 2, or 3, wherein, said optical processing board is a divergence lens.
 6. The light-emitting diode illuminated light-emitting module according to claim 1, 2, or 3, wherein, the light reflection cavity board is placed below said reflection board, and the outgoing holes for the electrodes are placed on said light reflection cavity board.
 7. The light-emitting diode illuminated light-emitting module according to claim 1, 2, or 3, wherein, said electrode pads and the associated connections are made of the transparent and conductive materials.
 8. The light-emitting diode illuminated light-emitting module according to claim 1, 2, or 3, wherein, said optical processing board and said transparent substrate are produced as an integral.
 9. The light-emitting diode illuminated light-emitting module according to claim 6, wherein, the fix holes or fix pins are placed at the bottom part or the side part, or the bottom part and the side part of said light reflection cavity board.
 10. The light-emitting diode illuminated light-emitting module according to claim 2, wherein, the insulation materials are coated over the surface of said electrode pads and the associated connections of said transparent substrate.
 11. The light-emitting diode illuminated light-emitting module according to claim 2, wherein, the spaces corresponding to the electrode pads and the associated connections of the transparent substrate are reserved on the reflection mirrors of the reflection board.
 12. The light-emitting diode illuminated light-emitting module according to claim 2, wherein, said light-emitting diode chips are placed at the focus of said parabolic reflection board.
 13. The light-emitting diode illuminated light-emitting module according to claim 1, 2, or 3, wherein, said light-emitting module is constructed by a single reflection board only, and comprising a single light-emitting diode chip only, to configure a monomeric structure.
 14. The light-emitting diode illuminated light-emitting module according to claim 1, 2, or 3, wherein, a plurality of the light-emitting diode chips are included in said light-emitting module, and a plurality of the light-emitting diode chips may be arranged in a line to configure an in-line structure.
 15. The light-emitting diode illuminated light-emitting module according to claim 1, 2, or 3, wherein, a plurality of the light-emitting diode chips are included in said light-emitting module, and a plurality of the light-emitting diode chips may be arranged in a plurality of lines to configure an array structure. 